Patent Assignment
Reel/Frame 030141/0553
Assignment of Assignor's Interest
Recorded: 2013-04-03
Pages: 4
Assignors
CHEN, CHIH-HAO
Executed: 2013-03-28
KO, CHUNG-CHI
Executed: 2013-03-28
TSAI, HSIN-YI
Executed: 2013-03-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structure with Kinked Profile