Patent Assignment
Reel/Frame 030179/0883
Assignment of Assignor's Interest
Recorded: 2013-04-09
Pages: 4
Assignors
TSAI, YU-PENG
Executed: 2013-03-04
LU, WEN-HSIUNG
Executed: 2013-03-04
TU, CHIA-WEI
Executed: 2013-03-04
CHENG, MING-DA
Executed: 2013-03-04
LIU, CHUNG-SHI
Executed: 2013-03-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Directly Sawing Wafers Covered with Liquid Molding Compound