Assignment of Assignor's Interest

Recorded: 2013-04-09 Pages: 4

Assignor

YANG, WANG-LAI

Executed: 2013-03-27

Assignees

AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.,ZHONGSHAN TORCH HI-TECH DEVELOPMENT ZONE, ZHONGSHAN, CHINA

66, CHUNG SHAN ROAD, TU-CHENG DIST., NEW TAIPEI, TAIWAN

Covered Property (1)

Package Assembly and Method of Manufacturing the Same

Patent: 8,981,571 →

Application: 13/859,561 →

Publication: US 2014/0054792

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.