IP Library Assignment 030209/0376
Patent Assignment
Reel/Frame 030209/0376

Assignment of Assignor's Interest

Recorded: 2013-04-12 Pages: 4
Assignors
LE NEEL, OLIVIER
Executed: 2013-03-27
SHANKAR, RAVI
Executed: 2013-03-27
CHERIAN, SUMAN
Executed: 2013-03-27
LEUNG, CALVIN
Executed: 2013-03-27
LOH, TIEN-CHOY
Executed: 2013-03-27
KAM, SHIAN-YEU
Executed: 2013-03-27
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Integrated Multi-Sensor Module
Patent: 9,176,089 →
Application: 13/853,732 →
Publication: US 2014/0291677
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2022
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060127/0427 →