Patent Assignment
Reel/Frame 060127/0427
Assignment of Assignor's Interest
Recorded: 2022-06-07
Pages: 9
Assignor
STMICROELECTRONICS PTE LTD
Executed: 2022-05-31
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Properties
(37)
Cap for a Microelectromechanical System Device with Electromagnetic Shielding, and Method of Manufacture
Methods for Adjusting Adhesion Strength During Sensor Processing
Method of Selectively Deglazing P205
Wafer Handling Station Including Cassette Members with Lateral Wafer Confining Brackets and Associated Methods
Photoresist Delivery System Including Control Valve and Associated Methods
Overmold with Single Attachment Using Optical Film
Method for Making Image Sensors Using Wafer-Level Processing and Associated Devices
Pnp Apparatus and Pnp Tool Head with Direct Bonding Pressure Pick-Up Tip
Electronic Device Having a Contact Recess and Related Methods
System in Package Manufacturing Method Using Wafer-to-Wafer Bonding
Image Sensor Device with Ir Filter and Related Methods
Method for Making Paired Lenses with an Opaque Barrier Between, and Product Made
Electronic Device Including Electrically Conductive Vias Having Different Cross-Sectional Areas and Related Methods
Self-Sealing Membrane for Mems Devices
Optical Electronic Package
Lens Mount with Conductive Glue Pocket for Grounding to a Circuit Board
Apparatus and Method to Attach a Wireless Communication Device into a Semiconductor Package
Contact Having an Angled Portion
Methods and Devices for Packaging Integrated Circuits
Accumulated Power Consumption Sensor: Application in Smart Batteries Systems
Integrated Multi-Sensor Module
Microelectronic Environmental Sensing Module
Durable Miniature Gas Composition Detector Having Fast Response Time
Semiconductor Packages Having an Electric Device with a Recess
Adhesive Bonding Technique for Use with Capacitive Micro-Sensors
Ink Jet Printhead with Polarity-Changing Driver for Thermal Resistors
Semiconductor Optical Package and Method
Optoelectronics Assembly and Method of Making Optoelectronics Assembly
Surface Mount Package for a Semiconductor Integrated Device, Related Assembly and Manufacturing Process
Integrated Multi-Sensor Module
Durable Miniature Gas Composition Detector Having Fast Response Time
Integrated Multi-Sensor Module
Durable Miniature Gas Composition Detector Having Fast Response Time
Semiconductor Packages Having an Electric Device with a Recess
Semiconductor Optical Package and Method
Integrated Multi-Sensor Module
Integrated Multi-Sensor Module
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 31, 2012
From: TEYSSEYRE, JEROME; DE LOS REYES, GLENN; LIM, WEE CHIN JUDY
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 028299/0641 →
Assignment of Assignor's Interest
Jul 24, 2012
From: YU, YING; LOH, TIENCHOY; KAM, SHIANYEU
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 028623/0150 →
Assignment of Assignor's Interest
Sep 28, 2012
From: WONG, WING SHENQ; LOOI, HK
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 029048/0870 →
Assignment of Assignor's Interest
Oct 15, 2012
From: LOOI, HK; CHEH, CHENGHAI; TOH, HAIKIN
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 029128/0077 →
Assignment of Assignor's Interest
Oct 15, 2012
From: JIN, YONGGANG; HERARD, LAURENT; LIM, WEECHINJUDY
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 029127/0930 →
Assignment of Assignor's Interest
Oct 18, 2012
From: BACTASA, ROMOLO
To: STMICROELECTRONICS PTE. LTD.
Reel/Frame 029151/0737 →
Assignment of Assignor's Interest
Oct 24, 2012
From: HERARD, LAURENT
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 029184/0295 →
Assignment of Assignor's Interest
Oct 29, 2012
From: CHUA, HONG-GAP; CHAN, YEE-CHUNG; MUK, MEI-YU
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 029205/0005 →
Assignment of Assignor's Interest
Nov 9, 2012
From: GEORGE, GINO; KOH, KEENYIP; LEE, CHEECHIANG; ADNAN, DITTO
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 029271/0293 →
Assignment of Assignor's Interest
Mar 18, 2013
From: COFFY, ROMAIN; SAUGIER, ERIC; LOOI, HK; CHEVRIER, NORBERT
To: STMICROELECTRONICS (GRENOBLE 2) SAS; STMICROELECTRONICS PTE LTD
Reel/Frame 030030/0607 →
Assignment of Assignor's Interest
Mar 28, 2013
From: LIM, WEE CHIN JUDY
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 030108/0932 →
Assignment of Assignor's Interest
Apr 10, 2013
From: JIN, YONGGANG; LIU, YUN; HUANG, YAOHUANG
To: STMICROELECTRONICS PTE. LTD.
Reel/Frame 030188/0136 →
Assignment of Assignor's Interest
Apr 19, 2013
From: HWANG, HOW YUAN; MAGHIRANG, JAY; HUANG, YAOHUANG; GOH, KIM-YONG
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 030252/0619 →
Assignment of Assignor's Interest
May 28, 2013
From: BINTANG, YOHANES
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 030496/0101 →
Assignment of Assignor's Interest
Jun 3, 2013
From: SHANKAR, RAVI; LE NEEL, OLIVIER; KAM, SHIAN YEU; LOH, TIEN CHOY
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 030536/0183 →
Assignment of Assignor's Interest
May 15, 2014
From: JIN, YONGGANG; HWANG, HOW YUAN
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 032902/0240 →
Corrective Assignment to Correct the Assignee Previously Recorded at Reel: 029127 Frame: 0930. Assignor(S) Hereby Confirms the Assignment.
Feb 17, 2015
From: JIN, YONGGANG; HERARD, LAURENT; LIM, WEE CHIN JUDY
To: STMICROELECTRONICS PTE LTD
Reel/Frame 035015/0910 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 029128 Frame: 0077. Assignor(S) Hereby Confirms the Assignment.
Mar 12, 2015
From: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
To: STMICROELECTRONICS PTE LTD
Reel/Frame 035188/0192 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 029128 Frame: 0077. Assignor(S) Hereby Confirms the Assignment.
Mar 12, 2015
From: LOOI, HK
To: STMICROELECTRONICS PTE LTD
Reel/Frame 035186/0938 →
Corrective Assignment to Correct the Assignee Name and Address Previously Recorded at Reel: 029271 Frame: 0293. Assignor(S) Hereby Confirms the Assignment.
Apr 3, 2015
From: GEORGE, GINO; KOH, KEENYIP; LEE, CHEECHIANG; ADNAN, DITTO
To: STMICROELECTRONICS PTE LTD.,
Reel/Frame 035364/0493 →
Assignment of Assignor's Interest
May 12, 2015
From: TEYSSEYRE, JEROME; JIN, YONGGANG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 035614/0564 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 032902 Frame: 0240. Assignor(S) Hereby Confirms the Assignment.
Mar 21, 2016
From: JIN, YONGGANG; HWANG, HOW YUAN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 038188/0397 →
Quitclaim Assignment
Apr 6, 2016
From: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
To: STMICROELECTRONICS PTE LTD
Reel/Frame 038362/0387 →
Quitclaim Assignment
Jun 6, 2022
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS PTE LTD
Reel/Frame 060391/0950 →
Assignment of Assignor's Interest
Jul 11, 2022
From: STMICROELECTRONICS (GRENOBLE 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060475/0759 →