Patent Assignment
Reel/Frame 030252/0619
Assignment of Assignor's Interest
Recorded: 2013-04-19
Pages: 5
Assignors
HWANG, HOW YUAN
Executed: 2012-09-28
MAGHIRANG, JAY
Executed: 2012-09-27
HUANG, YAOHUANG
Executed: 2013-02-22
GOH, KIM-YONG
Executed: 2012-09-27
HLA, PHONE MAW
Executed: 2012-09-27
SOON, EDMOND
Executed: 2012-09-27
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
System in Package Manufacturing Method Using Wafer-to-Wafer Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.