IP Library Assignment 035186/0938
Patent Assignment
Reel/Frame 035186/0938

Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 029128 Frame: 0077. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2015-03-12 Pages: 5
Assignor
LOOI, HK
Executed: 2015-01-19
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO, INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Pnp Apparatus and Pnp Tool Head with Direct Bonding Pressure Pick-Up Tip
Patent: 9,003,644 →
Application: 13/651,562 →
Publication: US 2014/0105717
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2012
From: LOOI, HK; CHEH, CHENGHAI; TOH, HAIKIN
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 029128/0077 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 029128 Frame: 0077. Assignor(S) Hereby Confirms the Assignment. Mar 12, 2015
From: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
To: STMICROELECTRONICS PTE LTD
Reel/Frame 035188/0192 →
Assignment of Assignor's Interest Jun 7, 2022
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060127/0427 →