Methods and devices for packaging integrated circuits
Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.
1. A packaged device comprising:
an integrated circuit;
a first packaging component, at least a portion of a surface of the first packaging component being formed in a pattern of one or more protrusions and/or one or more cavities;
a second packaging component, at least a portion of a surface of the second packaging component or the integrated circuit being formed in a pattern of one or more cavities and/or one or more protrusions; and
an adhesive layer disposed between at least the patterned portion of the surface of the first packaging component and at least the patterned portion of the surface of the second packaging component or integrated circuit,
wherein the integrated circuit is at least partially enclosed between the first and second packaging components.
2. The packaged device of claim 1 , wherein the pattern in at least the portion of the surface of the first packaging component is a repeating pattern.
3. The packaged device of claim 1 , wherein the patterned portion of the surface of the first packaging component includes at least one cavity having a depth between 0.02 mm and 0.05 mm.
4. The packaged device of claim 1 , wherein the patterned portion of the surface of the first packaging component includes at least one cavity having a length between 0.22 mm and 0.50 mm, and/or having a width between 0.22 mm and 0.50 mm.
5. The packaged device of claim 1 , wherein the patterned portion of the surface of the first packaging component includes at least one protrusion having a height between 0.02 mm and 0.05 mm.
6. The packaged device of claim 1 , wherein the patterned portion of the surface of the first packaging component includes at least one protrusion having a length between 0.22 mm and 0.50 mm, and/or having a width between 0.22 mm and 0.50 mm.
7. The packaged device of claim 1 , wherein the patterned portion of the surface of the first packaging component is formed from a material, and wherein the material includes solder mask.
8. The packaged device of claim 1 , wherein at least a portion of a surface of the adhesive layer conforms to the pattern in at least the portion of the surface of the first packaging component.
9. The packaged device of claim 1 , wherein the pattern of one or more cavities and/or protrusions in at least the portion of the surface of the second packaging component differs from the pattern of one or more cavities and/or protrusions in at least the portion of the surface of the first packaging component.
10. The packaged device of claim 1 , wherein the pattern of one or more cavities and/or protrusions in at least the portion of the surface of the second packaging component alternates with the pattern of one or more cavities and/or protrusions in at least the portion of the surface of the first packaging component.
11. The packaged device of claim 1 , wherein the first and second packaging components form an open-cavity package, and wherein at least a portion of the integrated circuit is accessible via a cavity of the open-cavity package.
12. The packaged device of claim 10 , wherein the first packaging component is a substrate.
13. The packaged device of claim 10 , wherein the first packaging component is a lid.
14. The packaged device of claim 1 , wherein at least a portion of the surface of the integrated circuit is formed according to a pattern of one or more cavities and/or protrusions.
15. The packaged device of claim 1 , wherein the integrated circuit comprises a sensor.
16. The packaged device of claim 15 , wherein the sensor is a pressure sensor, an acoustic sensor, or a microphone.
17. The packaged device of claim 15 , wherein the sensor is a MEMS (micro-electromechanical system) device.
18. An electronic device comprising the packaged device of claim 1 , wherein the electronic device is a portable computing device, tablet computer, mobile phone, smart phone, and/or electronic navigation device.