Patent Assignment
Reel/Frame 030128/0835
Assignment of Assignor's Interest
Recorded: 2013-04-02
Pages: 3
Assignors
GOH, KIM-YONG
Executed: 2013-03-05
MA, YIYI
Executed: 2013-03-05
GOH, WEI ZHEN
Executed: 2013-03-05
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK II, AVENUE 3, SINGAPORE 569508, SINGAPORE
Covered Property
(1)
Methods and Devices for Packaging Integrated Circuits
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.