Semiconductor packages having an electric device with a recess
Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.
1. A package comprising:
a substrate having a first surface; and
an electric device over the first surface of the substrate, the electric device including a membrane suspended above a cavity and transducer elements located at outer edges of the membrane, the electric device including a single body that includes a first portion and a second portion that forms a protrusion that extends from the first portion, wherein the protrusion fixes the first surface of the substrate, the protrusion and the first portion together forming a recess around at least a portion of a perimeter of the single body, the transducer elements being located over the recess, the recess being above the first surface of the substrate.
2. The package of claim 1 wherein the electronic device is a sensor that includes the membrane suspended above the cavity, the recess being located below end portions of the membrane.
3. The package of claim 2 wherein the sensor is a piezoresistor pressure sensor.
4. The package of claim 1 , wherein the recess extends around the entire perimeter of the back surface.
5. The package of claim 1 wherein the recess is substantially square shaped.
6. The package of claim 1 , further comprising an integrated circuit having an upper surface and a bottom surface, the bottom surface of the integrated circuit being secured to the first surface of the substrate, wherein the first portion of the back surface of the electric device is fixed relative to the first surface of the substrate by being secured to the upper surface of the integrated circuit.
7. A package comprising:
a substrate having an upper surface;
an electric device located over the substrate, the electric device including a single body that includes first and second portions, the second portion forming a protrusion that extends from the first portion; and
adhesive material securing the protrusion to the upper surface of the substrate such that the first portion of the single body is spaced from the upper surface of the substrate thereby forming a recess, the adhesive material completely filling the recess and located on only a portion of a side surface of the electric device above the recess forming an adhesive fillet.
8. The package of claim 7 wherein the electric device is one of a sensor and an integrated circuit.
9. The package of claim 7 wherein the recess extends around a perimeter of the back surface of the sensor.
10. The package of claim 7 wherein the adhesive material completely fills the recess.
11. The package of claim 10 wherein the adhesive material is further located on a side surface of the electric device above the recess forming an adhesive fillet.
12. The package of claim 7 wherein the adhesive fillet is visible outside of the package.
13. A package comprising:
a substrate having a first surface; and
an electric device coupled to the first surface of the substrate, the electric device including a membrane suspended above a cavity and transducer elements located at a perimeter of the membrane, the electric device including a single body that includes a first portion and a second portion that forms a protrusion extending from the first portion,
wherein the protrusion is fixed to the first surface of the substrate and the second portion of the single body forms a recess around at least a portion of a perimeter of the single body, the transducer elements being located over the recess, and the recess being above the first surface of the substrate.
14. The package of claim 13 wherein the recess is around an entire perimeter of the single body.
15. The package of claim 13 wherein the cavity is a buried cavity.
16. The package of claim 13 further including a lid coupled to the substrate and covering the electronic device.