Microelectronic environmental sensing module
Sensors for air flow, temperature, pressure, and humidity are integrated onto a single semiconductor die within a miniaturized Venturi chamber to provide a microelectronic semiconductor-based environmental multi-sensor module that includes an air flow meter. One or more such multi-sensor modules can be used as building blocks in dedicated application-specific integrated circuits (ASICs) for use in environmental control appliances that rely on measurements of air flow. Furthermore, the sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. By integrating the Venturi chamber with accompanying environmental sensors, correction factors can be obtained and applied to compensate for temporal humidity fluctuations and spatial temperature variation using the Venturi apparatus.
1. An application-specific integrated circuit (ASIC), comprising:
a semiconductor substrate;
an integrated environmental sensing module that includes:
a pre-shaped packaging structure attached to the semiconductor substrate;
a Venturi flow chamber formed between the substrate and the pre-shaped packaging structure; and
a plurality of environmental micro-sensors on the semiconductor substrate and within the Venturi flow chamber; and
a protective silicon cap on the integrated environmental sensing module, wherein a continuous exposure of the integrated environmental sensing module to a same ambient environment is provided by a sensor window in the silicon cap.
2. The ASIC of claim 1 wherein the Venturi flow chamber has a gas inlet and a gas outlet, and the environmental micro-sensors include:
a capacitive relative humidity sensor;
a first resistive temperature sensor and a first capacitive pressure sensor, positioned for continuous exposure to an ambient environment near the gas inlet; and
a second temperature sensor and a second pressure sensor positioned for continuous exposure to the ambient environment near the gas outlet.
3. The ASIC of claim 1 wherein the integrated environmental sensing module further comprises interconnect circuitry to extract signals from the micro-sensors.
4. The ASIC of claim 1 wherein the gas inlet is constricted.
5. The ASIC of claim 1 wherein the silicon cap is a patterned silicon wafer adhesively bonded to the integrated environmental sensing module.
6. The ASIC of claim 1 wherein the silicon cap includes at least one opening through which electrical connections can be made to the integrated environmental sensing module.
7. The ASIC of claim 1 , further comprising logic circuitry in the substrate, the logic circuitry configured to read and process signals generated within the integrated environmental sensing module.