Patent Assignment
Reel/Frame 030223/0881
Assignment of Assignor's Interest
Recorded: 2013-04-16
Pages: 3
Assignor
IMAFUJI, KEI
Executed: 2013-01-31
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Method of Manufacturing the Same