Patent Assignment
Reel/Frame 030226/0047
Assignment of Assignor's Interest
Recorded: 2013-04-16
Pages: 5
Assignors
TERUI, MAKOTO
Executed: 2013-04-02
KOMATSU, DAIKI
Executed: 2013-04-02
KUNIEDA, MASATOSHI
Executed: 2013-04-02
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board and Method for Manufacturing the Same