IP Library Assignment 030229/0592
Patent Assignment
Reel/Frame 030229/0592

Assignment of Assignor's Interest

Recorded: 2013-04-04 Pages: 3
Assignor
OKUDA, KAZUYUKI
Executed: 2012-10-10
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO 1018980, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device, Method of Processing Substrate, Substrate Processing Apparatus, and Non-Transitory Computer-Readable Recording Medium
Patent: 8,956,984 →
Application: 13/647,908 →
Publication: US 2013/0171838
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →