Patent Assignment
Reel/Frame 030239/0368
Assignment of Assignor's Interest
Recorded: 2013-04-18
Pages: 5
Assignors
WANG, MILL-JER
Executed: 2013-04-15
PENG, CHING-NEN
Executed: 2013-04-15
LIN, HUNG-CHIH
Executed: 2013-04-15
LIN, WEI-HSUN
Executed: 2013-04-15
HSU, SEN-KUEI
Executed: 2013-04-15
LIU, DE-JIAN
Executed: 2013-04-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Test-Yield Improvement Devices for High-Density Probing Techniques and Method of Implementing the Same