IP Library › Assignment 030249/0020
Patent Assignment
Reel/Frame 030249/0020

Assignment of Assignor's Interest

Recorded: 2013-04-19 Pages: 3
Assignors
MEYER, THORSTEN
Executed: 2013-04-10
OFNER, GERALD
Executed: 2013-04-10
Assignee
INTEL MOBILE COMMUNICATIONS GMBH
AM CAMPEON 10-12, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Chip Interposer, Semiconductor Device, and Method for Manufacturing a Semiconductor Device
Patent: 9,263,376 →
Application: 13/862,524 →
Publication: US 2014/0306355
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest Aug 29, 2022
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 061356/0001 →