Patent Assignment
Reel/Frame 030250/0377
Assignment of Assignor's Interest
Recorded: 2013-04-19
Pages: 2
Assignor
OTANI, SHINJI
Executed: 2013-04-04
Assignee
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Chip-Type Ceramic Electronic Component and Producing Method Thereof