Assignment of Assignor's Interest

Recorded: 2013-04-19 Pages: 3

Assignors

HIRAMATSU, SEIKI

Executed: 2013-03-27

TERAI, MAMORU

Executed: 2013-03-25

Assignee

MITSUBISHI ELECTRIC CORPORATION

7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN

Covered Property (1)

Semiconductor Device and Method for Manufacturing Semiconductor Device

Patent: 9,082,707 →

Application: 13/880,584 →

Publication: US 2013/0240909