Patent Assignment
Reel/Frame 030255/0627
Assignment of Assignor's Interest
Recorded: 2013-04-19
Pages: 4
Assignors
TSAI, SHU-TING
Executed: 2013-04-12
LIN, JENG-SHYAN
Executed: 2013-04-12
CHUANG, CHUN-CHIEH
Executed: 2013-04-12
YAUNG, DUN-NIAN
Executed: 2013-04-12
LIU, JEN-CHENG
Executed: 2013-04-12
HUNG, FENG-CHI
Executed: 2013-04-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Interconnect Structure and Method of Forming Same