Patent Assignment
Reel/Frame 030258/0579
Assignment of Assignor's Interest
Recorded: 2013-04-15
Pages: 4
Assignors
LEE, YANG JE
Executed: 2012-11-09
SHIN, JAE HO
Executed: 2012-11-09
YANG, DEK GIN
Executed: 2012-11-09
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
150, MAEYEONG-RO, YEONGTONG-GU, SUWON, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Rigid-Flexible Printed Circuit Board