Patent Assignment
Reel/Frame 030265/0022
Assignment of Assignor's Interest
Recorded: 2013-04-23
Pages: 8
Assignors
HARADA, YOSHIYUKI
Executed: 2013-01-23
HIKOSAKA, TOSHIKI
Executed: 2013-01-23
YOSHIDA, HISASHI
Executed: 2013-01-24
HUNG, HUNG
Executed: 2013-01-23
SUGIYAMA, NAOHARU
Executed: 2013-01-24
NUNOUE, SHINYA
Executed: 2013-01-24
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Wafer for Semiconductor Device Having a Multilayer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.