IP Library › Assignment 030269/0444
Patent Assignment
Reel/Frame 030269/0444

Assignment of Assignor's Interest

Recorded: 2013-04-23 Pages: 3
Assignors
CHEN, KIM HONG
Executed: 2013-03-11
HUNG, WENSEN
Executed: 2013-03-11
HUANG, SZU-PO
Executed: 2013-03-11
JENG, SHIN-PUU
Executed: 2013-03-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Cooling Packaged Semiconductor Devices
Patent: 9,224,673 →
Application: 13/791,077 →
Publication: US 2014/0252585
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Application Number Previously Recorded at Reel: 030269 Frame: 0444. Assignor(S) Hereby Confirms the Assignment. Sep 20, 2018
From: CHEN, KIM HONG; HUNG, WENSEN; HUANG, SZU-PO; JENG, SHIN-PUU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048172/0921 →