IP Library Assignment 030308/0416
Patent Assignment
Reel/Frame 030308/0416

Assignment of Assignor's Interest

Recorded: 2013-04-29 Pages: 3
Assignor
SEKIHARA, KANJI
Executed: 2013-04-12
Assignee
KONICA MINOLTA, INC.
2-7-2 MARUNOUCHI, CHIYODA-KU, TOKYO, 100-7015, JAPAN
Covered Property (1)
Microchip, Molding Die for Microchip, and Manufacturing Apparatus for Manufacturing Microchip
Patent: 9,238,322 →
Application: 13/882,352 →
Publication: US 2013/0209733
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 27, 2015
From: KONICA MINOLTA, INC.
To: WAKO PURE CHEMICAL INDUSTRIES, LTD.; KONICA MINOLTA, INC.
Reel/Frame 036436/0344 →
Change of Name Oct 3, 2018
From: WAKO PURE CHEMICAL INDUSTRIES, LTD.
To: FUJIFILM WAKO PURE CHEMICAL CORPORATION
Reel/Frame 047045/0687 →