IP Library Assignment 030312/0932
Patent Assignment
Reel/Frame 030312/0932

Assignment of Assignor's Interest

Recorded: 2013-04-25 Pages: 4
Assignors
CRISP, RICHARD DEWITT
Executed: 2013-04-16
HABA, BELGACEM
Executed: 2013-04-03
ZOHNI, WAEL
Executed: 2013-04-03
Assignee
INVENSAS CORP.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Co-Support Module and Microelectronic Assembly
Patent: 8,848,392 →
Application: 13/840,542 →
Publication: US 2014/0055942
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Resubmission of Corrective Assignment Under Notice of Non-Rec. 502938399 Correcting Name of Assignee to Invensas Corporation Previously Recorded on Reel 030312 Frame 0932. Assignor(S) Hereby Confirms the Assignment. Aug 18, 2014
From: HABA, BELGACEM; ZOHNI, WAEL; CORPORATION, INVENSAS
To: INVENSAS CORPORATION
Reel/Frame 033685/0331 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0661 →
Change of Name Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073689/0793 →