Patent Assignment
Reel/Frame 030317/0249
Assignment of Assignor's Interest
Recorded: 2013-04-30
Pages: 2
Assignee
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Conductive Material, Bonding Method Using the Same, and Bonded Structure