Patent Assignment
Reel/Frame 030329/0508
Assignment of Assignor's Interest
Recorded: 2013-05-01
Pages: 3
Assignors
LAI, JUI HSIEH
Executed: 2013-04-24
KUO, YING-HAO
Executed: 2013-04-24
CHEN, HAI-CHING
Executed: 2013-04-24
BAO, TIEN-I
Executed: 2013-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Package Structure and Methods of Forming Same