Patent Assignment
Reel/Frame 030336/0587
Assignment of Assignor's Interest
Recorded: 2013-05-02
Pages: 4
Assignors
SATO, TAKAHIRO
Executed: 2013-04-24
CHO, TAKAYUKI
Executed: 2013-04-24
KOSHIOKA, SHUNSUKE
Executed: 2013-04-24
OHSHIMA, TETSUYA
Executed: 2013-04-24
SAKAMOTO, NAOYA
Executed: 2013-04-24
Assignee
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
398, HASE, ATSUGI-SHI, KANAGAWA-KEN, 243-0036, JAPAN
Covered Property
(1)
Method for Forming Wiring, Semiconductor Device, and Method for Manufacturing Semiconductor Device