IP Library › Assignment 030347/0506
Patent Assignment
Reel/Frame 030347/0506

Assignment of Assignor's Interest

Recorded: 2013-05-03 Pages: 6
Assignors
TING, CHIH-YUAN
Executed: 2013-03-22
WU, CHUNG-WEN
Executed: 2013-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Novel Patterning Approach for Improved Via Landing Profile
Patent: 9,312,222 →
Application: 13/794,999 →
Publication: US 2014/0264902