Patent Assignment
Reel/Frame 030350/0375
Assignment of Assignor's Interest
Recorded: 2013-05-03
Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2002-01-18
LEE, JIN-YUAN
Executed: 2002-01-18
HUANG, CHING-CHENG
Executed: 2002-01-18
Assignee
MEGIC CORPORATION
21, R&D 1ST. RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Integrated Chip Package Structure Using Ceramic Substrate and Method of Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030350/0456 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →