IP Library › Assignment 030350/0456
Patent Assignment
Reel/Frame 030350/0456

Assignment of Assignor's Interest

Recorded: 2013-05-03 Pages: 4
Assignor
MEGIC CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
ROOM 301/ 302, NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Integrated Chip Package Structure Using Ceramic Substrate and Method of Manufacturing the Same
Patent: 8,835,221 →
Application: 13/887,093 →
Publication: US 2013/0309812
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2013
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN; HUANG, CHING-CHENG
To: MEGIC CORPORATION
Reel/Frame 030350/0375 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →