Patent Assignment
Reel/Frame 030369/0424
Assignment of Assignor's Interest
Recorded: 2013-05-08
Pages: 4
Assignor
CHO, YUN-RAE
Executed: 2013-04-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package, Semiconductor Device Having the Same, and Method of Manufacturing the Same