Patent Assignment
Reel/Frame 030422/0239
Assignment of Assignor's Interest
Recorded: 2013-05-15
Pages: 4
Assignors
SUN, YAOFENG
Executed: 2013-05-15
XIE, BIN
Executed: 2013-05-15
SHI, XUNQING
Executed: 2013-05-15
DONG, OU
Executed: 2013-05-15
Assignee
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED
3/F, BIO-INFORMATICS CENTRE, 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, SHATIN, NEW TERRITORIES, HONG KONG, HONG KONG
Covered Property
(1)
Method for Optimizing Electrodeposition Process of a Plurality of Vias in Wafer