Patent Assignment
Reel/Frame 030436/0126
Assignment of Assignor's Interest
Recorded: 2013-05-17
Pages: 8
Assignors
OMOTO, SEIICHI
Executed: 2013-04-17
UOZUMI, YOSHIHIRO
Executed: 2013-04-18
IGUCHI, TADASHI
Executed: 2013-04-18
YAMANE, OSAMU
Executed: 2013-04-24
MASUKAWA, KAZUYUKI
Executed: 2013-04-18
YANAI, YOSHIHIRO
Executed: 2013-04-18
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing a Semiconductor Device Including a Stacked Body Comprising Pluralities of First and Second Metallic Conductive Layers