Patent Assignment
Reel/Frame 030444/0836
Assignment of Assignor's Interest
Recorded: 2013-05-20
Pages: 3
Assignor
GOEDEN, RICHARD M.
Executed: 2013-05-16
Assignee
FLIR SYSTEMS, INC.
27700 SW PARKWAY AVENUE, WILSONVILLE, OREGON, 97070
Covered Property
(1)
Wafer Level Packaging of Microbolometer Vacuum Package Assemblies
Application:
61/747,867 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 25, 2013
From: SCHWEIKERT, PAUL; SHARPE, ANDREW; CARLSON, GREGORY A.; MATSON, ALEX
To: FLIR SYSTEMS, INC.
Reel/Frame 029871/0159 →
Merger and Change of Name
Nov 24, 2021
From: FLIR SYSTEMS, INC.; FIREWORK MERGER SUB II, LLC
To: TELEDYNE FLIR, LLC
Reel/Frame 058832/0915 →