IP Library › Patent Application 61747867
Patent Application Provisional
App. No. 61/747,867 · Confirmation No. 4327

WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES

Applicant: FLIR Systems, Inc.
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2013-05-23 APP.FILE.REC Filing Receipt 3 View
2013-05-14 R48.REQ Request under Rule 48 correcting inventorship 1 View
2013-05-14 ADS Application Data Sheet 8 View
2013-05-14 WFEE Fee Worksheet (SB06) 2 View
2013-05-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
2013-01-16 APP.FILE.REC Filing Receipt 3 View
2012-12-31 TR.PROV Provisional Cover Sheet (SB16) 4 View
2012-12-31 ADS Application Data Sheet 7 View
2012-12-31 SPEC Specification 23 View
2012-12-31 CLM Claims 4 View
2012-12-31 ABST Abstract 1 View
2012-12-31 DRW Drawings-only black and white line drawings 35 View
2012-12-31 WFEE Fee Worksheet (SB06) 2 View
2012-12-31 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
61/747,867
Filed
2012-12-31