IP Library Assignment 030453/0689
Patent Assignment
Reel/Frame 030453/0689

Assignment of Assignor's Interest

Recorded: 2013-05-21 Pages: 6
Assignors
HORNG, JAW-JUINN
Executed: 2013-05-17
HSIEH, CHUNG-PENG
Executed: 2013-05-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Shielding for Through-Silicon-Via
Patent: 9,219,038 →
Application: 13/795,035 →
Publication: US 2014/0264772