Patent Assignment
Reel/Frame 030455/0892
Assignment of Assignor's Interest
Recorded: 2013-05-21
Pages: 5
Assignors
CHUANG, CHUN-CHIEH
Executed: 2013-04-24
YAUNG, DUN-NIAN
Executed: 2013-05-06
LIU, JEN-CHENG
Executed: 2013-05-06
HUNG, FENG-CHI
Executed: 2013-04-29
HSU, TZU-HSUAN
Executed: 2013-05-02
TSAI, SHU-TING
Executed: 2013-04-24
KAO, MIN-FENG
Executed: 2013-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Sructure for Stacked Device and Method