Patent Assignment
Reel/Frame 030470/0581
Assignment of Assignor's Interest
Recorded: 2013-05-23
Pages: 4
Assignor
KUNG, CHEN-YUEH
Executed: 2013-03-12
Assignee
VIA TECHNOLOGIES, INC.
8F, 533, ZHONGZHENG RD., XINDIAN DIST.,, NEW TAIPEI CITY, 231, TAIWAN
Covered Property
(1)
Circuit Substrate, Semiconductor Package and Process for Fabricating the Same