Patent Assignment
Reel/Frame 030477/0786
Assignment of Assignor's Interest
Recorded: 2013-05-23
Pages: 3
Assignors
ZHANG, CHONG
Executed: 2013-04-11
LOTZ, STEFANIE M.
Executed: 2013-04-11
SALAMA, ISLAM A.
Executed: 2013-04-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Substrate with High Density Interconnect Design to Capture Conductive Features on Embedded Die
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.