Assignment of Assignor's Interest

Recorded: 2013-05-23 Pages: 5

Assignors

AMIR, NURIEL

Executed: 2013-05-21

CHOI, DONGSUB

Executed: 2013-04-26

ITZKOVICH, TAL

Executed: 2013-04-29

KANDEL, DANIEL

Executed: 2013-05-06

Assignee

KLA-TENCOR CORPORATION

ONE TECHNOLOGY DRIVE, MILPITAS, CALIFORNIA, 95035

Covered Properties (2)

Device Correlated Metrology (Dcm) for Ovl with Embedded Sem Structure Overlay Targets

Patent: 9,093,458 →

Application: 13/776,550 →

Publication: US 2014/0065736

Device Correlated Metrology (DCM) for OVL with Embedded SEM Structure Overlay Targets

Application: 61/697,503 →