Merger

Recorded: 2013-05-27 Received: 2013-05-27 Pages: 10

Assignor

FRONTENAC VENTURES LLC

Executed: 2013-02-12

Assignee

INTELLECTUAL VENTURES I LLC

2711 CENTERVILLE RD, SUITE 400, WILMINGTON, DE, 19808, UNITED STATES

Covered Properties (8)

Structure and Method for Parallel Testing of Dies on a Semiconductor Wafer

Application: 11/614,241 →

Structure and Method for Parallel Testing of Dies on a Semiconductor Wafer

Application: 11/614,252 →

Structure and Method for Parallel Testing of Dies on a Semiconductor Wafer

Application: 10/340,558 →

Integrated Circuit Having an Eeprom and Flash Eprom Using a Memory Cell with Source-Side Programming

Application: 10/100,508 →

Integrated Circuit Having an Eeprom and Flash Eprom

Application: 10/099,291 →

Non-Volatile Memory Architecture and Method of Operation

Application: 09/938,266 →

Testing Dies on a Semiconductor Wafer in a Sequential and Overlapping Manner

Application: 09/930,011 →

A Structure and Method of Operating an Array of Non-Volatile Memory Cell with Souce-Side Programming

Application: 09/757,088 →