Patent Assignment
Reel/Frame 030516/0913
Assignment of Assignor's Interest
Recorded: 2013-05-30
Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2013-05-23
HUNG, JUI-PIN
Executed: 2013-05-23
TSAI, PO-HAO
Executed: 2013-05-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package on Package (PoP) Bonding Structures