Patent Assignment
Reel/Frame 030516/0915
Assignment of Assignor's Interest
Recorded: 2013-05-30
Pages: 5
Assignors
TSAI, SHU-TING
Executed: 2013-05-13
YAUNG, DUN-NIAN
Executed: 2013-05-13
WANG, CHEN-JONG
Executed: 2013-05-13
LIU, JEN-CENG
Executed: 2013-05-13
HUNG, FENG-CHI
Executed: 2013-05-13
HSU, TZU-HSUAN
Executed: 2013-05-13
CHEN, U-TING
Executed: 2013-05-13
LIN, JENG-SHYAN
Executed: 2013-05-13
TSAI, SHUANG-JI
Executed: 2013-05-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Interconnect Structure and Method