Assignment of Assignor's Interest

Recorded: 2013-06-04 Pages: 8

Assignors

HUNG, CHING-WEN

Executed: 2013-05-21

HUANG, CHIH-SEN

Executed: 2013-05-21

HONG, SHIH-FANG

Executed: 2013-05-21

Assignee

UNITED MICROELECTRONICS CORP.

NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN

Covered Property (1)

Semiconductor Fin-Shaped Structure and Manufacturing Process Thereof

Patent: 8,802,521 →

Application: 13/909,101 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.