IP Library › Assignment 030554/0441
Patent Assignment
Reel/Frame 030554/0441

Assignment of Assignor's Interest

Recorded: 2013-06-06 Pages: 2
Assignors
NAKATANI, SEIICHI
Executed: 2013-04-05
KAWAKITA, KOJI
Executed: 2013-04-05
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Hybrid Substrate, Method for Manufacturing the Same, and Semiconductor Integrated Circuit Package
Patent: 9,107,306 →
Application: 13/879,139 →
Publication: US 2013/0200516
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
Corrective Assignment to Correct the Erroneously Filed Application Numbers 13/384239, 13/498734, 14/116681 and 14/301144 Previously Recorded on Reel 034194 Frame 0143. Assignor(S) Hereby Confirms the Assignment. Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →