Patent Assignment
Reel/Frame 030556/0515
Assignment of Assignor's Interest
Recorded: 2013-06-06
Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2013-03-14
HUNG, JUI-PIN
Executed: 2013-03-14
LIN, MIN-CHEN
Executed: 2013-03-14
LIN, YI-HANG
Executed: 2013-03-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Adhesion Between Post-Passivation Interconnect Structure and Polymer