Patent Assignment
Reel/Frame 030556/0593
Assignment of Assignor's Interest
Recorded: 2013-06-06
Pages: 2
Assignors
CHEN, JENG-SHIOU
Executed: 2013-03-13
TING, CHIH-YUAN
Executed: 2013-03-13
SHIEH, JYU-HORNG
Executed: 2013-03-13
TSAI, MINGHSING
Executed: 2013-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structure and Method of Forming the Same