Patent Assignment
Reel/Frame 030559/0981
Assignment of Assignor's Interest
Recorded: 2013-06-06
Pages: 2
Assignors
TSAI, PO-HAO
Executed: 2013-05-03
HUNG, JUI-PIN
Executed: 2013-05-03
LIN, JING-CHENG
Executed: 2013-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices