Assignment of Assignor's Interest

Recorded: 2013-06-07 Pages: 4

Assignors

MINAMIBORI, YUUJI

Executed: 2013-04-15

MINAMITANI, KOJI

Executed: 2013-04-23

KURAMOTO, TETSUNOBU

Executed: 2013-04-17

Assignee

SHOWA DENKO PACKAGING CO., LTD.

31, SUZUKAWA, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN

Covered Property (1)

Molding Packaging Material and Molded Case

Patent: 9,029,010 →

Application: 13/833,610 →

Publication: US 2013/0244088

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.