IP Library › Assignment 064374/0937
Patent Assignment
Reel/Frame 064374/0937

Change of Name

Recorded: 2023-07-25 Pages: 27
Assignor
SHOWA DENKO PACKAGING CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC PACKAGING CORPORATION
60 KIYOSAKICHO, HIKONE-SHI, SHIGA, 529-1156, JAPAN
Covered Properties (26)
Positive Electrode Tab Lead, Negative Electrode Tab Lead, and Battery
Patent: 9,070,919 →
Application: 13/141,141 →
Publication: US 2011/0305945
Tab Lead and Method of Producing the Same
Patent: 9,123,476 →
Application: 13/778,536 →
Publication: US 2014/0072869
Molding Packaging Material and Molded Case
Patent: 9,029,010 →
Application: 13/833,610 →
Publication: US 2013/0244088
Laminating Water-Based Surface Treatment Agent, Surface Treatment Method and Surface Treated Material
Patent: 9,076,999 →
Application: 13/868,201 →
Publication: US 2013/0280593
Molding Packaging Material and Battery Case
Patent: 9,515,299 →
Application: 14/007,652 →
Publication: US 2014/0087241
Molding Packaging Material and Battery Case
Patent: 9,623,629 →
Application: 14/007,653 →
Publication: US 2014/0134475
Outer Packaging Material for Battery, and Battery
Patent: 9,425,449 →
Application: 14/050,504 →
Publication: US 2014/0141299
Molding Packaging Material and Molded Case
Patent: 9,498,935 →
Application: 14/196,593 →
Publication: US 2014/0255764
Molding Packaging Material
Patent: 9,502,695 →
Application: 14/269,270 →
Publication: US 2014/0335402
Battery Packaging Material and Battery
Application: 14/289,751 →
Publication: US 2014/0356655
Molding Packaging Material, and Molded Case
Patent: 9,397,321 →
Application: 14/302,449 →
Publication: US 2014/0370368
Packaging Material and Molded Case
Application: 14/326,615 →
Publication: US 2015/0030910
Molding Packaging Material and Method for Producing Same
Application: 14/375,138 →
Publication: US 2015/0004476
Molding Packaging Material
Patent: 9,812,678 →
Application: 14/454,777 →
Publication: US 2015/0044546
Molding Material for Package
Patent: 9,553,284 →
Application: 14/511,285 →
Publication: US 2015/0104593
Method of Manufacturing Laminated Armoring Material
Patent: 9,925,740 →
Application: 14/679,176 →
Publication: US 2015/0283790
Electrochemical Device
Application: 14/702,920 →
Publication: US 2015/0325819
Thin Power Storage Device and Production Method Thereof
Application: 14/829,096 →
Publication: US 2016/0049625
Molding Packaging Material and Molded Case
Patent: 9,649,827 →
Application: 14/868,498 →
Publication: US 2016/0089861
Package for Power Storage Device
Application: 14/986,769 →
Publication: US 2016/0204394
Power Storage Device and Production Method Thereof
Application: 15/044,242 →
Publication: US 2016/0248052
Package for Power Storage Device and Power Storage Device
Application: 15/196,211 →
Publication: US 2017/0005299
Molding Packaging Material and Battery Case
Patent: 9,553,283 →
Application: 15/275,618 →
Publication: US 2017/0012250
Molding Packaging Material and Battery Case
Patent: 9,662,858 →
Application: 15/448,654 →
Publication: US 2017/0179444
Method of Manufacturing Laminated Armoring Material
Application: 15/896,111 →
Publication: US 2018/0170001
Thin Power Storage Device and Production Method Thereof
Application: 16/033,247 →
Publication: US 2018/0323410
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 1, 2011
From: TADA, KIYOSHI; HASHIMOTO, DAISUKE; YAMAZAKI, SATOSHI
To: SHOWA DENKO K.K.
Reel/Frame 026841/0591 →
Assignment of Assignor's Interest Jun 7, 2013
From: MINAMIBORI, YUUJI; MINAMITANI, KOJI; KURAMOTO, TETSUNOBU
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 030563/0960 →
Assignment of Assignor's Interest Jun 14, 2013
From: HATA, HIROSHI; WATANABE, TAKUROU
To: SHOWA DENKO PACKAGING CO., LTD.; SHOWA DENKO K.K.
Reel/Frame 030611/0810 →
Assignment of Assignor's Interest Nov 27, 2013
From: KURAMOTO, TETSUNOBU; MINAMIBORI, YUUJI
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 031683/0337 →
Assignment of Assignor's Interest Nov 27, 2013
From: KURAMOTO, TETSUNOBU; MINAMIBORI, YUUJI
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 031683/0272 →
Assignment of Assignor's Interest Jan 30, 2014
From: YOSHINO, KENJI
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 032089/0810 →
Assignment of Assignor's Interest Mar 5, 2014
From: SHOWA DENKO K.K.
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 032354/0366 →
Assignment of Assignor's Interest Mar 5, 2014
From: HASHIMOTO, DAISUKE; WATANABE, TAKUROU
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 032354/0328 →
Assignment of Assignor's Interest Mar 5, 2014
From: SHOWA DENKO K.K.
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 032354/0426 →
Assignment of Assignor's Interest May 7, 2014
From: MINAMIBORI, YUUJI; KURAMOTO, TETSUNOBU
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 032837/0032 →
Assignment of Assignor's Interest Jul 7, 2014
From: YOSHINO, KENJI
To: SHOWA DENKO PACKAGING CO. LTD.
Reel/Frame 033247/0204 →
Assignment of Assignor's Interest Jul 31, 2014
From: MINAMIBORI, YUJI
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 033434/0031 →
Assignment of Assignor's Interest Aug 1, 2014
From: KAIBIN, ZENG; TAKADA, SUSUMU
To: SHOWA DENKO PACKAGING CO.,LTD.
Reel/Frame 033442/0134 →
Assignment of Assignor's Interest Aug 20, 2014
From: MINAMIBORI, YUJI; WANG, HONGLIN
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 033569/0311 →
Assignment of Assignor's Interest Oct 3, 2014
From: MINAMIBORI, YUJI; WANG, HONGLIN
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 033877/0648 →
Assignment of Assignor's Interest Oct 29, 2014
From: MINAMIBORI, YUJI; WANG, HONGLIN
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 034057/0738 →
Assignment of Assignor's Interest Feb 2, 2015
From: ITO, TAKAHIRO; KOMANO, JUNYA; IMAHORI, MAKOTO; KURAMOTO, TETSUNOBU
To: SHOWA DENKO PACKAGING CO., LTD.; TOAGOSEI CO., LTD.,
Reel/Frame 034864/0010 →
Assignment of Assignor's Interest Apr 24, 2015
From: MINAMITANI, KOJI
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 035486/0059 →
Assignment of Assignor's Interest May 27, 2015
From: MINAMITANI, KOJI
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 035719/0773 →